"C. Xie,Y. Liu,K. Fushinobu,R. Yasui,T. Shinoda","Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,"  I123",,,2023,May
"Xie Centian,K. Fushinobu,R. Yasui,T. Shinoda","Package’s Solder Crack Detection Technique by Thermal Resistance","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,,,,2023,May
"Riyo Kawakami,Kazunari Hashimoto,Ryuta Yasui,KAZUYOSHI FUSHINOBU,Takuya Shinoda","ECUにおける放熱材を応用した伝熱設計に関する研究","第60回日本伝熱シンポジウム","第60回日本伝熱シンポジウム講演論文集",,,,,2023,May
"Kazunari Hashimoto,Riyo Kawakami,Ryuta Yasui,Haruki Takei,KAZUYOSHI FUSHINOBU,Takuya Shinoda,Keita Oumi","半導体モデルを利用した放熱材料の最適配置","自動車技術会2021年春季大会学術講演会","自動車技術会2023年春季大会学術講演会予稿集",,,,,2023,May
"M. Inaba,Hiroki Nakamizo,Wataru Hijikata,T. Okura,Ryuta Yasui,HIROKI TAKAHARA,KAZUYOSHI FUSHINOBU,Hideaki Fujita,Takuya Shinoda,Keita Oumi","動的アクチュエータのモデリングによる発熱量損失算出の提案","自動車技術会2021年春季大会学術講演会","自動車技術会2023年春季大会学術講演会予稿集",,,,,2023,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,"Vol. 13","No. 3","pp. 315-322",2023,