"Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Munetaka Kurokawa,Takehiko Kikuchi,Takuya Mitarai,Toshiyuki Nitta,Tohma Watanabe,Hidenari Fujikata,Nobuhiko Nishiyama,Hideki Yagi","SOA Integrated InP/Si Hybrid Tunable Laser by Utilizing Chip-on-Wafer Hydrophilic Bonding","IEEE Silicon Photonics Conference",,,,,,2024,Apr.
"Takehiko Kikuchi,Munetaka Kurokawa,Naoki Fujiwara,Naoko Inoue,Takuya Mitarai,Hidenari Fujikata,Takuo Hiratani,Toshiyuki Nitta,Yuhki Itoh,Tohma Watanabe,Chang-Yong Lee,Akira Furuya,Tsuyoshi Horikawa,Nobuhiko Nishiyama,Hideki Yagi","Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process","IEEE Silicon Photonics Conference",,,,,,2024,Apr.
"Takehiko Kikuchi,Munetaka Kurokawa,Naoki Fujiwara,Naoko Inoue,Takuya Mitarai,Hidenari Fujikata,Takuo Hiratani,Toshiyuki Nitta,Yuhki Itoh,Tohma Watanabe,Chang-Yong Lee,Akira Furuya,Tsuyoshi Horikawa,Nobuhiko Nishiyama,Hideki Yagi","Monolithic integration of various types of InP-based epitaxial structures on Si-photonic circuit using III-V chip-on-SOI wafer bonding","第71回応用物理学会春季学術講演会",,,,,,2024,Mar.
"Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Munetaka Kurokawa,Takehiko Kikuchi,Takuya Mitarai,Toshiyuki Nitta,Tohma Watanabe,Hidenari Fujikata,Nobuhiko Nishiyama,Hideki Yagi","Hybrid tunable lasers with InP-based gain region bonded on Si-slab waveguide structure","電子情報通信学会総合大会",,,,,,2024,Mar.
"Naoko Inoue,Takuo Hiratani,Naoki Fujiwara,Takehiko Kikuchi,Munetaka Kurokawa,Takuya Mitarai,Toshiyuki Nitta,Tohma Watanabe,Nobuhiko Nishiyama,Hideki Yagi","SOA integrated hybrid tunable laser by InP chip-on-SOI wafer bonding using UV-ozone hydrophilization","第71回応用物理学会春季学術講演会",,,,,,2024,Mar.
"Naoko Inoue,Takehiko Kikuchi,Naoki Fujiwara,Munetaka Kurokawa,Takuo Hiratani,Toshiyuki Nitta,Akira Furuya,Chang-Yong Lee,Yuhki Itoh,Nobuhiko Nishiyama,Hideki Yagi","Stable CW operation of III-V/Si hybrid lasers by chip-on-wafer direct bonding technique using UV-ozone hydrophilization","2023 IEEE Photonics Conference",,,,,,2023,Nov.
"Takehiko Kikuchi,Munetaka Kurokawa,Naoki Fujiwara,Naoko Inoue,Takuo Hiratani,Toshiyuki Nitta,Takuya Mitarai,Yuhki Itoh,Chang-Yong Lee,Akira Furuya,Yoshitaka Oiso,Nobuhiko Nishiyama,Hideki Yagi","III-V gain region/Si waveguide hybrid lasers by chip-on-wafer hydrophilic bonding process using UV-ozone treatment",,,,,,,2023,Oct.
"R. Sasaki,T. Katsuyama,Y. Oiso,T. Kikuchi,Moataz Eissa,T. Amemiya1,N. Nishiyama","A study of the effect of misalignment between III-V/Si waveguides  in direct bonding GaInAsP/SOI optical devices","The Institute of Electronics, Information and Communication Engineers",,,,,,2023,Sept.
"Takehiko Kikuchi,Munetaka Kurokawa,Naoki Fujiwara,Naoko Inoue,Takuo Hiratani,Toshiyuki Nitta,Takuya Mitarai,Yuhki Itoh,Yoshitaka Oiso,Nobuhiko Nishiyama,Hideki Yagi","Room-temperature CW operation of hybrid lasers by InP/SOI chip-on-wafer bonding with UV-ozone hydrophilization","第70回応用物理学会春季学術講演会",,,,,,2023,Mar.
"Moataz Eissa,Takehiko Kikuchi,Yoshitaka Ohiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Low-thermal-resistance GaInAsP/SOI ridge-waveguide hybrid lasers","2023年電子情報通信学会総合大会",,,,,,2023,Mar.
"Ryuya Sasaki,勝山 造,Yoshitaka Oiso,Takehiko Kikuchi,エイッサ モータズ,Tomohiro Amemiya,Nobuhiko Nishiyama","直接接合GaInAsP/SOI光デバイスの活性層光閉じ込め係数制御に向けた層構造の検討","第70回応用物理学会春季学術講演会",,,,,,2023,Mar.
"Shaher Anis Mahmoud Eissa Moataz,Takehiko Kikuchi,Yoshitaka Oiso,Tomohiro Amemiya,Nobuhiko Nishiyama","High thermal performance hybrid GaInAsP/SOI ridge waveguide lasers with enhanced heat dissipation structure",,"Japanese Journal of Applied Physics",,"vol. 62","no. 1","pp. 010905",2023,Jan.
"Moataz Eissa,Takehiko Kikuchi,Yoshitaka Ohiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Low-thermal-resistance by Decoupled Ridge Insulation Structure for hybrid GaInAsP/SOI ridge-waveguide lasers","International Semiconductor Laser Conference 2022","ISLC2022",,,,,2022,Oct.
"Moataz Eissa,Takehiko Kikuchi,Yoshitaka Ohiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Thermal resistance reduction of ridge-waveguide III-V/SOI hybrid lasers by thin ridge-insulation","2022 IEICE Society Meeting","2022年度電子情報通信学会ソサイエティ大会",,,,,2022,Sept.
"Yutaka Makihara,Nobuhiko Nishiyama,Takehiko Kikuchi,Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Toshiyuki Nitta,Moataz Eissa,Takuya Mitarai,Yuning Wang,Yoshitaka Oiso,Tomohiro Amemiya,Hideki Yagi","Characteristics of GaInAsP/SOI Hybrid Semiconductor Optical Amplifier with InP-based Two-storied Ridge Structure","27th Optoelectronics and Communication Conference",,,,,,2022,July
"Takehiko Kikuchi,Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Toshiyuki Nitta,Moataz Eissa,Takuya Mitarai,Yuning Wang,Yoshitaka Oiso,Nobuhiko Nishiyama,Hideki Yagi","III?V gain region/Si waveguide hybrid lasers with InP-based two-storied ridge structure by direct bonding technology",,"Japanese Journal of Applied Physics",,"Vol. 61","Number 5","  052002",2022,May
"Takuo Hiratani,Naoki Fujiwara,Takehiko Kikuchi,Naoko Inoue,Tsutomu Ishikawa,Toshiyuki Nitta,Moataz Eissa,Yoshitaka Oiso,Nobuhiko Nishiyama,Hideki Yagi","III-V gain region/Si external cavity hybrid tunable lasers with InP-based two-storied ridge structure","27th International Semiconductor Laser Conference (ISLC)",,,,,,2021,Oct.
"Hiromu Onodera,Takehiko Kikuchi,Yoshitaka Oiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Bonding Position Accuracy of Direct Transfer Bonding,  Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration","7th International Workshop on Low Temperature Bonding for 3D Integration",,,,,,2021,Oct.
"Hiromu Onodera,Takehiko Kikuchi,Yoshitaka Oiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Bonding Position Accuracy of Direct Transfer Bonding,  Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration","第82回 応用物理学会秋季学術講演会",,,,,,2021,Sept.
"Takehiko Kikuchi,Takuo Hiratani,Naoki Fujiwara,井上 尚子,Toshiyuki Nitta,Shaher Anis Mahmoud Eissa Moataz,Takuya Mitarai,Yoshitaka Oiso,Nobuhiko Nishiyama,Hideki Yagi","多段テーパ構造によるInP系利得領域/Si導波路光結合部を有するハイブリッド集積レーザの波長可変動作","第68回応用物理学会春季講演会","応用物理学会予稿集",,,,,2021,Mar.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Vol. 59",,"p. SBBD02",2020,May
"Takuo Hiratani,Naoki Fujiwara,Takehiko Kikuchi,Toshiyuki Nitta,Shaher Anis Mahmoud Eissa Moataz,Yuning Wang,Yutaka Makihara,Nobuhiko Nishiyama,Hideki Yagi","Room temperature-continuous wave operation of III-V/Si hybrid lasers with two-storied ridge structure","2020年電子情報通信学会総合大会",,,,,,2020,Mar.
"Takehiko Kikuchi,Naoki Fujiwara,Takuo Hiratani,Toshiyuki Nitta,Moataz Eissa,Yuning Wang,Yutaka Makihara,Nobuhiko Nishiyama,Hideki Yagi","Dependence of Si waveguide width on properties of RWG-lasers with III-V/Si direct bonding structure","第67回応用物理学会春季学術講演会",,,,,,2020,Feb.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Volume 59","Number SB","pp. SBBD02-1",2019,Dec.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Yagi Hideki,Toshiyuki Nitta,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama","引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制","第80回応用物理学会秋季学術講演会",,,,,,2019,Sept.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration","2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)",,,,,,2019,May
"Takayuki Miyazaki,Fumihito Tachibana,Takehiko Kikuchi,Takuo Hiratani,Hideki Yagi,Moataz Eissa,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform","Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019)",,,,,,2019,May
"Liu Bai,Takehiko Kikuchi,Takuya Mitarai,Nobuhiko Nishiyama,Hideki Yagi,Tomohiro Amemiya,Shigehisa Arai","Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding","第66回応用物理会春季学術講演会",,,,,,2019,Mar.
"Takayuki Miyazaki,Fumihito Tachibana,Takehiko Kikuchi,Takuo Hiratani,Yagi Hideki,Shaher Anis Mahmoud Eissa Moataz,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,SHIGEHISA ARAI","III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性","電子情報通信学会 2018年総合大会",,,,,,2019,Mar.
"Takehiko Kikuchi,Junichi Suzuki,Fumihito Tachibana,Naoko Inoue,Hideki Yagi,Moataz Eissa,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","High optical coupling efficiency by double taper-type coupler structure towards III-V/Si hybrid photonic integration","電子情報通信学会 光エレクトロニクス研究会（OPE）","IEICE technical report",,"Vol. 118","No. 348","pp. 161-164",2018,Dec.
"Liu Bai,Takehiko Kikuchi,Takuya Mitarai,Nobuhiko Nishiyama,Hideki Yagi,Tomohiro Amemiya,Shigehisa Arai","Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits","電子情報通信学会 光エレクトロニクス研究会（OPE）","IEICE technical report",,"Vol. 118","No. 348","pp. 149-153",2018,Dec.