"Yi-Chieh Tsai,Chia-Hsuan Lee,Hsin-Chi Chang,Jui-Han Liu,Han-Wen Hu,Hiroyuki Ito,Young Suk Kim,Takayuki Ohba,Kuan-Neng Chen","Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via",,"IEEE Transactions on Electron Devices",,"Vol. 68","No. 7","pp. 3520 - 3525",2021,July
"Yi-Lun Yang,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba,Kuan-Neng Chen","Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,,,,2020,Jan.
"Yi-Lun Yang,Jia-Ling Liu,Guan Wei Chen,Shoichi  Kodama,Kyosuke Kobinata,Kuan-Neng Chen,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba","Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation","International Conference on Electronics Packaging",,,,,"pp. 28-31",2019,Apr.
"Yoriko Mizushima,Youngsuk Kim,Tomoji Nakamura,Akira Uedono,Takayuki Ohba","Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure",,"Microelectronic Engineering","ELSEVIER","Vol. 167",,"pp. 23-31",2017,Jan.
"Y. S. Kim,S. Kodama,Y. Mizushima,T. Nakamura,N. Maeda,K. Fujimoto,A. Kawai,T. Ohba","Warpage-free Ultra-Thinning ranged from 2 to 5-ƒÊm for DRAM Wafers and Evaluation of Devices Characteristics","2016 IEEE 66th Electronic Components and Technology Conference","Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th","IEEE",,,"pp. 1471-1476",2016,June
"Mizushima Yoriko,Kim Youngsuk,Nakamura Tomoji,Sugie Ryuichi,Hashimoto Hideki,Uedono Akira,Ohba Takayuki","Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration",,"Jpn. J. Appl. Phys.","Institute of Physics","Vol. 53","No. 5",,2014,Apr.
"Noriyuki Taoka,Osamu Nakatsuka,Yoriko Mizushima,Hideki Kitada,Young Suk Kim,Tomoji Nakamura,Takayuki Ohba,Shigeaki Zaima","Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction",,"Japanese Journal of Applied Physics",,"Volume 53",,,2014,Apr.
"Akira Uedono,Yoriko Mizushima,Youngsuk Kim,Tomoji Nakamura,Takayuki Ohba,Nakaaki Yoshihara,Nagayasu Oshima,Ryoichi Suzuki","Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic",,"Journal of Applied Physics","AIP","Vol. 116","  134501",,2014,