"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Volume 59","Number SB","pp. SBBD02-1",2019,Dec.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Yagi Hideki,Toshiyuki Nitta,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama","引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制","第80回応用物理学会秋季学術講演会",,,,,,2019,Sept.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration","2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)",,,,,,2019,May
"Takayuki Miyazaki,Fumihito Tachibana,Takehiko Kikuchi,Takuo Hiratani,Hideki Yagi,Moataz Eissa,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform","Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019)",,,,,,2019,May
"Liu Bai,Takehiko Kikuchi,Takuya Mitarai,Nobuhiko Nishiyama,Hideki Yagi,Tomohiro Amemiya,Shigehisa Arai","Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding","第66回応用物理会春季学術講演会",,,,,,2019,Mar.
"Takayuki Miyazaki,Fumihito Tachibana,Takehiko Kikuchi,Takuo Hiratani,Yagi Hideki,Shaher Anis Mahmoud Eissa Moataz,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,SHIGEHISA ARAI","III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性","電子情報通信学会 2018年総合大会",,,,,,2019,Mar.