"Kazuyoshi Fushinobu","Research topics on the laser-based production technology","Chiron Group",,,,,,2019,Nov.
"T. Shinoda,R. Yasui,W. Woo,K. Fushinobu,T. Tomimura","Influence of two screw fastening distances on contact thermal resistance","ISTP30","Proc. ISTP30",,,"No. ISTP021",,2019,Nov.
"S. Kawakita,Y. Ishizaka,K. Fushinobu","Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement","ISTP30","Proc. ISTP30",,,"No. ISTP165",,2019,Nov.
"K. Yamazaki,M. Qi,K. Kato,S. Kuramoto,K. Fushinobu","Thermal Conductivity of Composite Thermal Interface Materials using Copper Metal Foam","ISTP30","Proc. ISTP30",,,"No. ISTP235",,2019,Nov.
"E. Dursunkaya,S. Kawasaki,K. Hemmi,K. Yamazaki,S. Kuramoto,K. Kato,K. Fushinobu","Investigation of the Effect of Paper Types on the Paper Temperature in the Electrophotographic Process by Using Machine Learning","ISTP30","Proc. ISTP30",,,"No. ISTP012",,2019,Nov.
"H. Maki,K. Fushinobu,R. Yasui,T. Shinoda","Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement","ISTP30","Proc. ISTP30",,,"No. ISTP150",,2019,Nov.
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","Transient thermal response investigation of multiple heat-source electronic systems","ISTP30","Proc. ISTP30",,,"No. ISTP212",,2019,Nov.
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor","ISTP30","Proc. ISTP30",,,"No. ISTP134",,2019,Nov.
"Yuki Ishizaka,寺西 美波,KAZUYOSHI FUSHINOBU,Shinya Kawakita","オープンセル型銅フォームを用いた車載電子機器用複合放熱部材の熱伝導率評価","日本機械学会熱工学コンファレンス2019","日本機械学会熱工学コンファレンス2019講演論文集",,,"No. B122",,2019,Oct.
"Shenghui Liu,Yuta Nakamura,Ryoya Iseki,KAZUYOSHI FUSHINOBU","透明材料の短パルスレーザ加?特性","日本機械学会熱工学コンファレンス2019","日本機械学会熱工学コンファレンス2019講演論文集",,,"No. F224",,2019,Oct.
"S. Kawasaki,K. Yamazaki,K. Henmi,S. Kuramoto,K. Kato,K. Fushinobu","Prediction and Control Technique of the Paper Media Temperature after Fusing in Electrophotographic Process","InterPACK2019","InterPACK2019",,,"No. 6396",,2019,Oct.
"Y. Nakamura,K. Fushinobu,A. Tamura","Numerical analysis of pulse laser assisted curing region of photocurable resins","InterPACK2019","InterPACK2019",,,"No. 6356",,2019,Oct.
"Takuya Shinoda,安井 竜太,K. Karjadi,KAZUYOSHI FUSHINOBU,富村 寿夫","大きなうねりを有する固体間の接触熱抵抗の測定手法","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D111",,2019,May
"Z. Li,J.V. Thomsen Silveira,K. Fushinobu,R. Yasui,T. Shinoda","Heat dissipation measurement of electronic component by means of external heater and heat flux sensor","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D112",,2019,May
"J.V. Thomsen Silveira,Z. Li,K. Fushinobu,R. Yasui,T. Shinoda","3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver","第56回日本伝熱シンポジウム","第56回日本伝熱シンポジウム講演論文集",,,"No. D124",,2019,May
"J.V. Thomsen Silveira,Z. Li,B. Yang,R. Yasui,T. Shinoda,K. Fushinobu","Analysis of heat transfer from a heat dissipating device on a substrate","ITherm 2019","Proc. ITherm2019",,,"No. 400",,2019,May