"Hiromu Onodera,Takehiko Kikuchi,Yoshitaka Oiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Bonding Position Accuracy of Direct Transfer Bonding,  Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration","7th International Workshop on Low Temperature Bonding for 3D Integration",,,,,,2021,Oct.
"Hiromu Onodera,Takehiko Kikuchi,Yoshitaka Oiso,Tomohiro Amemiya,Nobuhiko Nishiyama","Bonding Position Accuracy of Direct Transfer Bonding,  Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration","第82回 応用物理学会秋季学術講演会",,,,,,2021,Sept.