"Yi-Chieh Tsai,Chia-Hsuan Lee,Hsin-Chi Chang,Jui-Han Liu,Han-Wen Hu,Hiroyuki Ito,Young Suk Kim,Takayuki Ohba,Kuan-Neng Chen","Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via",,"IEEE Transactions on Electron Devices",,"Vol. 68","No. 7","pp. 3520 - 3525",2021,July