"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Volume 59","Number SB","pp. SBBD02-1",2019,Dec.
"‹e’n Œ’•F,”’ –φ,ŒδŽθτ ‘ρ–ξ,”ͺ–Ψ ‰pŽχ,V“c r”V,ŒΓμ «l,‰J‹{ ’qG,ΌŽR L•F","ˆψ’£‚θ˜c‘w‚Ι‚ζ‚ιSiŠξ”γInP¬•ΠΪ‡ŠE–ʂ̐‚’Ό‰ž—Ν—}§","‘ζ80‰ρ‰ž—p•¨—Šw‰οH‹GŠwpu‰‰‰ο",,,,,,2019,Sept.
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration","2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)",,,,,,2019,May
"Takayuki Miyazaki,Fumihito Tachibana,Takehiko Kikuchi,Takuo Hiratani,Hideki Yagi,Moataz Eissa,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform","Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019)",,,,,,2019,May
"”’ –φ,‹e’n Œ’•F,ŒδŽθτ ‘ρ–ξ,ΌŽR L•F,”ͺ–Ψ ‰pŽχ,‰J‹{ ’qG,rˆδ Ž ‹v","Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding","‘ζ66‰ρ‰ž—p•¨—‰οt‹GŠwpu‰‰‰ο",,,,,,2019,Mar.
"‹{›½ —²”V,—§‰Τ •Άl,‹e’n Œ’•F,•½’J ‘ρΆ,”ͺ–Ψ ‰pŽχ,Moataz Eissa,ŒδŽθτ ‘ρ–ξ,‰J‹{ ’qG,ΌŽR L•F,rˆδ Ž ‹v","III-V/SiƒnƒCƒuƒŠƒbƒhWΟƒvƒ‰ƒbƒgƒz[ƒ€ŽΐŒ»‚ΙŒό‚―‚½ƒnƒCƒuƒŠƒbƒh/ƒVƒŠƒRƒ“—Μˆζ2’iƒe[ƒp“±”g˜H‚Μƒe[ƒp\‘’ˆΛ‘Ά«","“dŽqξ•ρ’ʐMŠw‰ο 2018”N‘‡‘ε‰ο",,,,,,2019,Mar.