"Y. S. Kim,S. Kodama,Y. Mizushima,T. Nakamura,N. Maeda,K. Fujimoto,A. Kawai,T. Ohba","Warpage-free Ultra-Thinning ranged from 2 to 5-ƒÊm for DRAM Wafers and Evaluation of Devices Characteristics","2016 IEEE 66th Electronic Components and Technology Conference","Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th","IEEE",,,"pp. 1471-1476",2016,June