"Y. S. Kim,S. Kodama,Y. Mizushima,T. Nakamura,N. Maeda,K. Fujimoto,A. Kawai,T. Ohba","Warpage-free Ultra-Thinning ranged from 2 to 5-ƒÊm for DRAM Wafers and Evaluation of Devices Characteristics","2016 IEEE 66th Electronic Components and Technology Conference","Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th","IEEE",,,"pp. 1471-1476",2016,June
"Aki Dote,Hideki Kitada,Yoriko Mizushima,Tomoji Nakamura,Seiki Sakuyama","Characterization of Warpages and Layout-Dependent Local-Deformations for Large Die 3D Stacking","2016 IEEE 66th Electronic Components and Technology Conference","Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th","IEEE",,,"pp. 1899",2016,June
"Dote Aki,Kitada Hideki,Mizushima Yoriko,Nakamura Tomoji,Sakuyama Seiki","Analyzing and modeling methods for warpages of thin and large dies with redistribution layer",,"Jpn. J. Appl. Phys.","Institute of Physics","Vol. 55","No. 6",,2016,May