"Yi-Lun Yang,Jia-Ling Liu,Guan Wei Chen,Shoichi  Kodama,Kyosuke Kobinata,Kuan-Neng Chen,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba","Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation","International Conference on Electronics Packaging",,,,,"pp. 28-31",2019,Apr.