@article{CTT100893469,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2023,
}

@article{CTT100875342,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2022,
}

@article{CTT100851453,
  author = {Takuya Shinoda and Ryuta Yasui and Woo Wonsub and Karim Rasyid Karjadi and Hiroki Nakamizo and KAZUYOSHI FUSHINOBU and Hisao Tomimura},
  title = {Study on thermal contact resistance between bolted flat plates (Proposal of reduction method for thermal contact resistance by means of arc shaped waviness)},
  journal = {Thermal Science and Engineering},
  year = 2021,
}

@article{CTT100875335,
  author = {Z. Li and H. Haketa and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement},
  journal = {Microelectronics Reliability},
  year = 2021,
}

@article{CTT100875337,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor},
  journal = {Transactions of The Japan Institute of Electronics Packaging},
  year = 2021,
}

@inproceedings{CTT100915603,
  author = {K. Hashimoto and R. Yasui and M. Inaba and T. Egami and Y. Ariga and D. Mukoyama and H. Takei and KAZUYOSHI FUSHINOBU and Takuya Shinoda and K. Ohomi},
  title = {MBDを利用した放熱材料配置のロバスト設計},
  booktitle = {自動車技術会2024年春季大会学術講演会予稿集},
  year = 2024,
}

@inproceedings{CTT100915608,
  author = {Yuanting Shen and H. Nakamizo and Takuya Shinoda and R. Yasui and KAZUYOSHI FUSHINOBU},
  title = {伝熱計測による次世代自動車用電子機器発熱量の予測},
  booktitle = {第61回日本伝熱シンポジウム講演論文集},
  year = 2024,
}

@inproceedings{CTT100915606,
  author = {Hiromu Ishii and H. Matsuoka and KAZUYOSHI FUSHINOBU and Takuya Shinoda},
  title = {車載用ECUジャンクション温度低減のための接触熱抵抗の予測},
  booktitle = {第61回日本伝熱シンポジウム講演論文集},
  year = 2024,
}

@inproceedings{CTT100915609,
  author = {K. Hashimoto and Riyo Kawakami and R. Yasui and Y. Matsuda and KAZUYOSHI FUSHINOBU and Takuya Shinoda and K. Ohomi},
  title = {ECUの伝熱設計における機械学習と熱回路網法を併用した解析時間の短縮},
  booktitle = {第61回日本伝熱シンポジウム講演論文集},
  year = 2024,
}

@inproceedings{CTT100893476,
  author = {Xie Centian and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Package’s Solder Crack Detection Technique by Thermal Resistance},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}

@inproceedings{CTT100915394,
  author = {C. Xie and Y. Liu and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}

@inproceedings{CTT100893473,
  author = {Riyo Kawakami and Kazunari Hashimoto and Ryuta Yasui and KAZUYOSHI FUSHINOBU and Takuya Shinoda},
  title = {ECUにおける放熱材を応用した伝熱設計に関する研究},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}

@inproceedings{CTT100893471,
  author = {Kazunari Hashimoto and Riyo Kawakami and Ryuta Yasui and Haruki Takei and KAZUYOSHI FUSHINOBU and Takuya Shinoda and Keita Oumi},
  title = {半導体モデルを利用した放熱材料の最適配置},
  booktitle = {自動車技術会2023年春季大会学術講演会予稿集},
  year = 2023,
}

@inproceedings{CTT100893470,
  author = {M. Inaba and Hiroki Nakamizo and Wataru Hijikata and T. Okura and Ryuta Yasui and HIROKI TAKAHARA and KAZUYOSHI FUSHINOBU and Hideaki Fujita and Takuya Shinoda and Keita Oumi},
  title = {動的アクチュエータのモデリングによる発熱量損失算出の提案},
  booktitle = {自動車技術会2023年春季大会学術講演会予稿集},
  year = 2023,
}

@inproceedings{CTT100875373,
  author = {H. Nakamizo and R. Yasui and Takuya Shinoda and KAZUYOSHI FUSHINOBU and T. Tomimura},
  title = {うねりやひずみを伴う金属個体間の接触熱抵抗の予測方法の提案},
  booktitle = {第59回日本伝熱シンポジウム講演論文集},
  year = 2022,
}

@inproceedings{CTT100853574,
  author = {Yuki MORISAKI and Minoru TANAKA and Satoshi TAKEUCHI and Atushi SHINMA and Koichi TANAKA and Sayaka OKABE and Takuya SHINODA and Tatsuya KAWAGUCHI and Takushi SAITO},
  title = {Cooling rate estimation in thickness direction of injection molded PPS plate by enthalpy measurement of crystalline fusion},
  booktitle = {Preprints of Seikei-Kakou Annual Meeting 2021},
  year = 2021,
}

@inproceedings{CTT100851457,
  author = {中溝 裕紀 and Joao Vitor Thomsen Silveira and KAZUYOSHI FUSHINOBU and Takuya Shinoda},
  title = {非定常熱流検出による電子部品の消費電力計測手法の提案 − 熱流センサによる非破壊高速検出手法},
  booktitle = {第58回日本伝熱シンポジウム講演論文集},
  year = 2021,
}

@inproceedings{CTT100851454,
  author = {H. Nazamizo and W. Wonsub and Karim Rasyid Karjadi and R. Yasui and Takuya Shinoda and KAZUYOSHI FUSHINOBU and H. Tomimura},
  title = {ECU車両組付け時における接触熱抵抗の低減手法及び予測方法の提案},
  booktitle = {自動車技術会2021年春季大会学術講演会予稿集},
  year = 2021,
}

@inproceedings{CTT100851455,
  author = {Takuya Shinoda and Hiramatsu and Yung Chi Liu and R. Yasui and KAZUYOSHI FUSHINOBU},
  title = {はんだ接続部の微細疲労き裂測定技術の開発 − 熱抵抗によるダイオードのはんだクラックの検出},
  booktitle = {第58回日本伝熱シンポジウム講演論文集},
  year = 2021,
}

@inproceedings{CTT100851456,
  author = {R. Yasui and Yung Chi Liu and Takuya Shinoda and KAZUYOSHI FUSHINOBU},
  title = {はんだ接続部の微細疲労き裂測定技術の開発 − チップコンデンサのはんだクラック非破壊検出},
  booktitle = {第58回日本伝熱シンポジウム講演論文集},
  year = 2021,
}

@inproceedings{CTT100851438,
  author = {Takuya Shinoda and KAZUYOSHI FUSHINOBU and Hiroaki Maki and Yung Chi Liu and Ryuta Yasui and Hiroki Nakamizo},
  title = {過渡熱抵抗でのはんだクラック率測定},
  booktitle = {第57回日本伝熱シンポジウム講演論文集},
  year = 2020,
}

@inproceedings{CTT100816026,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Transient thermal response investigation of multiple heat-source electronic systems},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816051,
  author = {T. Shinoda and R. Yasui and W. Woo and K. Fushinobu and T. Tomimura},
  title = {Influence of two screw fastening distances on contact thermal resistance},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816027,
  author = {H. Maki and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100816025,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor},
  booktitle = {Proc. ISTP30},
  year = 2019,
}

@inproceedings{CTT100815569,
  author = {J.V. Thomsen Silveira and Z. Li and B. Yang and R. Yasui and T. Shinoda and K. Fushinobu},
  title = {Analysis of heat transfer from a heat dissipating device on a substrate},
  booktitle = {Proc. ITherm2019},
  year = 2019,
}

@inproceedings{CTT100815572,
  author = {Takuya Shinoda and 安井 竜太 and K. Karjadi and KAZUYOSHI FUSHINOBU and 富村 寿夫},
  title = {大きなうねりを有する固体間の接触熱抵抗の測定手法},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100815571,
  author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement of electronic component by means of external heater and heat flux sensor},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100815570,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver},
  booktitle = {第56回日本伝熱シンポジウム講演論文集},
  year = 2019,
}

@inproceedings{CTT100789786,
  author = {J.V. Thomsen Silveira and B. Yang and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor},
  booktitle = {日本機械学会熱工学コンファレンス2018講演論文集},
  year = 2018,
}

@inproceedings{CTT100771151,
  author = {Hiroyuki Haketa and Zi Di Li and KAZUYOSHI FUSHINOBU and 安井 竜太 and Takuya Shinoda},
  title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement},
  booktitle = {第55回日本伝熱シンポジウム講演論文集},
  year = 2018,
}

@inproceedings{CTT100771156,
  author = {H. Haketa and M. Reininger and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda},
  title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement},
  booktitle = {},
  year = 2017,
}