@inproceedings{CTT100589441,
  author = {Tatsuya Ito and Kazuhisa Itoi and Masakazu Sato and Hiroshi Abe and Kenichi Okada and Kazuya Masu},
  title = {Integration of the passive element above IC wafers by applying Wafer Level Package technology},
  booktitle = {3rd International Workshop on High Frequency Micromagnetic Devices and Materials},
  year = 2005,
}

@inproceedings{CTT100589443,
  author = {Kazuhisa Itoi and Masakazu Sato and Hiroshi Abe and Hirotaka Sugawara and Hiroyuki Ito and Kenichi Okada and Kazuya Masu and Tatsuya Ito},
  title = {On-chip high-Q spiral Cu inductors embedded in wafer-level chip-scale package for silicon RF application},
  booktitle = {IEEE MTT-S International Microwave Symposium},
  year = 2004,
}