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Publication List - Takehiko Kikuchi 2019 (6 / 25 entries)
Journal Paper
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer,
Japanese Journal of Applied Physics,
Volume 59,
Number SB,
pp. SBBD02-1,
Dec. 2019.
International Conference (Reviewed)
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Hideki Yagi,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform,
Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019),
May 2019.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019),
May 2019.
Domestic Conference (Not reviewed / Unknown)
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Yagi Hideki,
Toshiyuki Nitta,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Yagi Hideki,
Shaher Anis Mahmoud Eissa Moataz,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
SHIGEHISA ARAI.
III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性,
電子情報通信学会 2018年総合大会,
Mar. 2019.
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Liu Bai,
Takehiko Kikuchi,
Takuya Mitarai,
Nobuhiko Nishiyama,
Hideki Yagi,
Tomohiro Amemiya,
Shigehisa Arai.
Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding,
第66回応用物理会春季学術講演会,
Mar. 2019.
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