International Conference (Reviewed)

• Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama. Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration, 7th International Workshop on Low Temperature Bonding for 3D Integration, Oct. 2021.
• Takuo Hiratani, Naoki Fujiwara, Takehiko Kikuchi, Naoko Inoue, Tsutomu Ishikawa, Toshiyuki Nitta, Moataz Eissa, Yoshitaka Oiso, Nobuhiko Nishiyama, Hideki Yagi. III-V gain region/Si external cavity hybrid tunable lasers with InP-based two-storied ridge structure, 27th International Semiconductor Laser Conference (ISLC), Oct. 2021.

Domestic Conference (Not reviewed / Unknown)

• Hiromu Onodera, Takehiko Kikuchi, Yoshitaka Oiso, Tomohiro Amemiya, Nobuhiko Nishiyama. Bonding Position Accuracy of Direct Transfer Bonding, Chip-on-wafer Bonding for III-V/Si Heterogeneous Integration, 第82回 応用物理学会秋季学術講演会, Sept. 2021.
• Takehiko Kikuchi, Takuo Hiratani, Naoki Fujiwara, 井上 尚子, Toshiyuki Nitta, Shaher Anis Mahmoud Eissa Moataz, Takuya Mitarai, Yoshitaka Oiso, Nobuhiko Nishiyama, Hideki Yagi. 多段テーパ構造によるInP系利得領域/Si導波路光結合部を有するハイブリッド集積レーザの波長可変動作, 第68回応用物理学会春季講演会, 応用物理学会予稿集, Mar. 2021.

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