@article{CTT100893469,
  author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2023,
}

@inproceedings{CTT100893470,
  author = {M. Inaba and Hiroki Nakamizo and Wataru Hijikata and T. Okura and Ryuta Yasui and HIROKI TAKAHARA and KAZUYOSHI FUSHINOBU and Hideaki Fujita and Takuya Shinoda and Keita Oumi},
  title = {動的アクチュエータのモデリングによる発熱量損失算出の提案},
  booktitle = {自動車技術会2023年春季大会学術講演会予稿集},
  year = 2023,
}

@inproceedings{CTT100893471,
  author = {Kazunari Hashimoto and Riyo Kawakami and Ryuta Yasui and Haruki Takei and KAZUYOSHI FUSHINOBU and Takuya Shinoda and Keita Oumi},
  title = {半導体モデルを利用した放熱材料の最適配置},
  booktitle = {自動車技術会2023年春季大会学術講演会予稿集},
  year = 2023,
}

@inproceedings{CTT100893473,
  author = {Riyo Kawakami and Kazunari Hashimoto and Ryuta Yasui and KAZUYOSHI FUSHINOBU and Takuya Shinoda},
  title = {ECUにおける放熱材を応用した伝熱設計に関する研究},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}

@inproceedings{CTT100893476,
  author = {Xie Centian and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Package’s Solder Crack Detection Technique by Thermal Resistance},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}

@inproceedings{CTT100915394,
  author = {C. Xie and Y. Liu and K. Fushinobu and R. Yasui and T. Shinoda},
  title = {Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement},
  booktitle = {第60回日本伝熱シンポジウム講演論文集},
  year = 2023,
}