@article{CTT100820708,
  author = {Yi-Lun Yang and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba and Kuan-Neng Chen},
  title = {Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2020,
}

@misc{CTT100821996,
  author = {Takayuki Ohba and Tomoji Nakamura},
  title = {Three-Dimensional Integration Technologies -Overview and Future Prospects},
  year = 2020,
}

@misc{CTT100883377,
  author = {Takayuki Ohba},
  title = {半導体装置及びその製造方法},
  howpublished = {PublishedPatent},
  year = 2022,
  month  = {},
  note   = {特願2020-217060(2020/12/25), 特開2022-102370(2022/07/07)}
}


@misc{CTT100883381,
  author = {Takayuki Ohba},
  title = {半導体装置及びその製造方法},
  howpublished = {PublishedPatent},
  year = 2022,
  month  = {},
  note   = {特願2020-217061(2020/12/25), 特開2022-102371(2022/07/07)}
}


@misc{CTT100865141,
  author = {Takayuki Ohba},
  title = {半導体装置および半導体装置の製造方法},
  howpublished = {RegisteredPatent},
  year = 2023,
  month  = {},
  note   = {特願2020-038816(2020/03/06), 特開2021-141238(2021/09/16), 特許第7411959号(2023/12/28)}
}


@misc{CTT100865146,
  author = {Takayuki Ohba},
  title = {半導体装置とその製造方法},
  howpublished = {RegisteredPatent},
  year = 2024,
  month  = {},
  note   = {特願2020-038818(2020/03/06), 特開2021-141240(2021/09/16), 特許第7424580号(2024/01/22)}
}


@misc{CTT100865155,
  author = {Takayuki Ohba},
  title = {半導体装置の製造方法},
  howpublished = {RegisteredPatent},
  year = 2023,
  month  = {},
  note   = {特願2020-038817(2020/03/06), 特開2021-141239(2021/09/16), 特許第7357288号(2023/09/28)}
}


@misc{CTT100865166,
  author = {Takayuki Ohba},
  title = {半導体装置とその制御方法},
  howpublished = {PublishedPatent},
  year = 2021,
  month  = {},
  note   = {特願2020-038815(2020/03/06), 特開2021-140555(2021/09/16)}
}


@misc{CTT100864136,
  author = {Takayuki Ohba},
  title = {半導体装置},
  howpublished = {RegisteredPatent},
  year = 2023,
  month  = {},
  note   = {特願2020-005051(2020/01/16), 特開2021-114347(2021/08/05), 特許第7340178号(2023/08/30)}
}


@misc{CTT100842085,
  author = {Takayuki Ohba},
  title = {半導体装置},
  howpublished = {RegisteredPatent},
  year = 2023,
  month  = {},
  note   = {特願2019-050061(2019/03/18), 特開2020-155474(2020/09/24), 特許第7222481号(2023/02/07)}
}


@misc{CTT100842104,
  author = {Takayuki Ohba},
  title = {半導体装置},
  howpublished = {RegisteredPatent},
  year = 2023,
  month  = {},
  note   = {特願2019-050060(2019/03/18), 特開2020-155473(2020/09/24), 特許第7255797号(2023/04/03)}
}