@article{CTT100738462,
  author = {Mizushima Yoriko and Kim Youngsuk and Nakamura Tomoji and Sugie Ryuichi and Hashimoto Hideki and Uedono Akira and Ohba Takayuki},
  title = {Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration},
  journal = {Jpn. J. Appl. Phys.},
  year = 2014,
}

@article{CTT100741616,
  author = {Noriyuki Taoka and Osamu Nakatsuka and Yoriko Mizushima and Hideki Kitada and Young Suk Kim and Tomoji Nakamura and Takayuki Ohba and Shigeaki Zaima},
  title = {Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction},
  journal = {Japanese Journal of Applied Physics},
  year = 2014,
}

@article{CTT100741620,
  author = {Akira Uedono and Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Takayuki Ohba and Nakaaki Yoshihara and Nagayasu Oshima and Ryoichi Suzuki},
  title = {Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic},
  journal = {Journal of Applied Physics},
  year = 2014,
}