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Publication List - Takuya Mitarai 2019 (17 / 40 entries)
Journal Paper
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer,
Japanese Journal of Applied Physics,
Volume 59,
Number SB,
pp. SBBD02-1,
Dec. 2019.
International Conference (Reviewed)
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Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Yasuyuki Miyamoto.
Fabrication of Si Photonics Waveguides by Thick Resist-Mask Electron Beam Lithography Proximity Effect Correction,
32nd International Microprocesses and Nanotechnology Conference (MNC 2019),
Oct. 2019.
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takuya mitarai,
moataz eissa,
takayuki miyazaki,
tomohiro amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Broadband Si waveguide loop mirror with curved directional coupler,
The 24th Optoelectronics and Communications Conference (OECC/PSC 2019),
July 2019.
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Hideki Yagi,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform,
Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019),
May 2019.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Hideki Yagi,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019),
May 2019.
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Yuning Wang,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Investigation of InP/Si bonding condition for optimizing Photoluminescence property by Surface Activated Bonding based on Fast Atom Beam,
Compound Semiconductor Week 2019: 31st International Conference on Indium Phosphide and Related Materials (IPRM 2019),
May 2019.
Domestic Conference (Not reviewed / Unknown)
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Takayuki Miyazaki,
Shaher Anis Mahmoud Eissa Moataz,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Study of the Relation between Thermal Resistance and Optical Gain in GaInAsP/SOI Hybrid SOA,
Photonic Device Workshop2019,
電子情報通信学会 LQE/OPE/PICS,
Dec. 2019.
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Yuning Wang,
Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
Investigation of Photoluminescence property of InP/SOI wafer after bonding experiment using Surface Activated Bonding based on Fast Atom Beam,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Takehiko Kikuchi,
Liu Bai,
Takuya Mitarai,
Yagi Hideki,
Toshiyuki Nitta,
Masato Furukawa,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Takayuki Miyazaki,
Takuya Mitarai,
Shaher Anis Mahmoud Eissa Moataz,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
III-V/Si ハイブリッドSOA高効率動作に向けた光学利得の熱抵抗依存性検討,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Moataz Eissa,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Yasuyuki Miyamoto.
Fabrication of Si Photonics Waveguides by Thick Resist-Mask Electron Beam Lithography Proximity Effect Correction,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Yuta Yokomura,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
1.3-µm 帯 SiN導波路における分散特性の検討,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Takuya Mitarai,
稲村 美希,
阿部 智之,
守田 憲司,
Tomohiro Amemiya,
Nobuhiko Nishiyama.
CMOSプロセス加工Siプラットフォーム上ハイブリッド光デバイスに向けたInP/Si直接接合へのSi側ダミーパターンの影響,
第80回応用物理学会秋季学術講演会,
Sept. 2019.
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Yuning Wang,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
Shigehisa Arai.
Investigation of InP/Si bonding condition for suppressing degradation of Photoluminescence property using Surface Activated Bonding,
第66回応用物理会春季学術講演会,
Mar. 2019.
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Takayuki Miyazaki,
Fumihito Tachibana,
Takehiko Kikuchi,
Takuo Hiratani,
Yagi Hideki,
Shaher Anis Mahmoud Eissa Moataz,
Takuya Mitarai,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
SHIGEHISA ARAI.
III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性,
電子情報通信学会 2018年総合大会,
Mar. 2019.
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Takuya Mitarai,
Shaher Anis Mahmoud Eissa Moataz,
Fumihito Tachibana,
Takayuki Miyazaki,
Tomohiro Amemiya,
Nobuhiko Nishiyama,
SHIGEHISA ARAI.
Si 曲げ導波路方向性結合器を用いたループミラーの作製と評価,
第66回応用物理会春季学術講演会,
Mar. 2019.
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Liu Bai,
Takehiko Kikuchi,
Takuya Mitarai,
Nobuhiko Nishiyama,
Hideki Yagi,
Tomohiro Amemiya,
Shigehisa Arai.
Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding,
第66回応用物理会春季学術講演会,
Mar. 2019.
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