@article{CTT100874041,
  author = {Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen},
  title = {Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via},
  journal = {IEEE Transactions on Electron Devices},
  year = 2021,
}

@article{CTT100820708,
  author = {Yi-Lun Yang and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba and Kuan-Neng Chen},
  title = {Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2020,
}

@article{CTT100738469,
  author = {Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Akira Uedono and Takayuki Ohba},
  title = {Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure},
  journal = {Microelectronic Engineering},
  year = 2017,
}

@article{CTT100738462,
  author = {Mizushima Yoriko and Kim Youngsuk and Nakamura Tomoji and Sugie Ryuichi and Hashimoto Hideki and Uedono Akira and Ohba Takayuki},
  title = {Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration},
  journal = {Jpn. J. Appl. Phys.},
  year = 2014,
}

@article{CTT100741616,
  author = {Noriyuki Taoka and Osamu Nakatsuka and Yoriko Mizushima and Hideki Kitada and Young Suk Kim and Tomoji Nakamura and Takayuki Ohba and Shigeaki Zaima},
  title = {Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction},
  journal = {Japanese Journal of Applied Physics},
  year = 2014,
}

@article{CTT100741620,
  author = {Akira Uedono and Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Takayuki Ohba and Nakaaki Yoshihara and Nagayasu Oshima and Ryoichi Suzuki},
  title = {Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic},
  journal = {Journal of Applied Physics},
  year = 2014,
}

@inproceedings{CTT100820715,
  author = {Yi-Lun Yang and Jia-Ling Liu and Guan Wei Chen and Shoichi  Kodama and Kyosuke Kobinata and Kuan-Neng Chen and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba},
  title = {Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100738574,
  author = {Y. S. Kim and S. Kodama and Y. Mizushima and T. Nakamura and N. Maeda and K. Fujimoto and A. Kawai and T. Ohba},
  title = {Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics},
  booktitle = {Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th},
  year = 2016,
}