@article{CTT100738469,
  author = {Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Akira Uedono and Takayuki Ohba},
  title = {Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure},
  journal = {Microelectronic Engineering},
  year = 2017,
}