@article{CTT100821117, author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai}, title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer}, journal = {Japanese Journal of Applied Physics}, year = 2019, } @inproceedings{CTT100803284, author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Yagi Hideki and Toshiyuki Nitta and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama}, title = {引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制}, booktitle = {}, year = 2019, } @inproceedings{CTT100803261, author = {Takayuki Miyazaki and Fumihito Tachibana and Takehiko Kikuchi and Takuo Hiratani and Hideki Yagi and Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai}, title = {Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform}, booktitle = {}, year = 2019, } @inproceedings{CTT100803265, author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai}, title = {High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration}, booktitle = {}, year = 2019, } @inproceedings{CTT100803289, author = {Takayuki Miyazaki and Fumihito Tachibana and Takehiko Kikuchi and Takuo Hiratani and Yagi Hideki and Shaher Anis Mahmoud Eissa Moataz and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and SHIGEHISA ARAI}, title = {III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性}, booktitle = {}, year = 2019, } @inproceedings{CTT100803297, author = {Liu Bai and Takehiko Kikuchi and Takuya Mitarai and Nobuhiko Nishiyama and Hideki Yagi and Tomohiro Amemiya and Shigehisa Arai}, title = {Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding}, booktitle = {}, year = 2019, }