@article{CTT100821117,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2019,
}

@inproceedings{CTT100819942,
  author = {Takayuki Miyazaki and Shaher Anis Mahmoud Eissa Moataz and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {Study of the Relation between Thermal Resistance  and Optical Gain in GaInAsP/SOI Hybrid SOA},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100828196,
  author = {Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Yasuyuki Miyamoto},
  title = {Fabrication of Si Photonics Waveguides by Thick Resist-Mask Electron Beam Lithography Proximity Effect Correction},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803281,
  author = {Yuning Wang and Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {Investigation of Photoluminescence property of InP/SOI wafer after bonding experiment using Surface Activated Bonding based on Fast Atom Beam},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803284,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Yagi Hideki and Toshiyuki Nitta and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803285,
  author = {Takayuki Miyazaki and Takuya Mitarai and Shaher Anis Mahmoud Eissa Moataz and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {III-V/Si ハイブリッドSOA高効率動作に向けた光学利得の熱抵抗依存性検討},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803276,
  author = {Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Yasuyuki Miyamoto},
  title = {Fabrication of Si Photonics Waveguides by Thick Resist-Mask Electron Beam Lithography Proximity Effect Correction},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803280,
  author = {Yuta Yokomura and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {1.3-µm 帯 SiN導波路における分散特性の検討},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803286,
  author = {Takuya Mitarai and 稲村 美希 and 阿部 智之 and 守田 憲司 and Tomohiro Amemiya and Nobuhiko Nishiyama},
  title = {CMOSプロセス加工Siプラットフォーム上ハイブリッド光デバイスに向けたInP/Si直接接合へのSi側ダミーパターンの影響},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803254,
  author = {takuya mitarai and moataz eissa and takayuki miyazaki and tomohiro amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Broadband Si waveguide loop mirror with curved directional coupler},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803261,
  author = {Takayuki Miyazaki and Fumihito Tachibana and Takehiko Kikuchi and Takuo Hiratani and Hideki Yagi and Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803265,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803264,
  author = {Yuning Wang and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Investigation of InP/Si bonding condition for optimizing Photoluminescence property by Surface Activated Bonding based on Fast Atom Beam},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803298,
  author = {Yuning Wang and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Investigation of InP/Si bonding condition for suppressing degradation of Photoluminescence property using Surface Activated Bonding},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803289,
  author = {Takayuki Miyazaki and Fumihito Tachibana and Takehiko Kikuchi and Takuo Hiratani and Yagi Hideki and Shaher Anis Mahmoud Eissa Moataz and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and SHIGEHISA ARAI},
  title = {III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803294,
  author = {Takuya Mitarai and Shaher Anis Mahmoud Eissa Moataz and Fumihito Tachibana and Takayuki Miyazaki and Tomohiro Amemiya and Nobuhiko Nishiyama and SHIGEHISA ARAI},
  title = {Si 曲げ導波路方向性結合器を用いたループミラーの作製と評価},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803297,
  author = {Liu Bai and Takehiko Kikuchi and Takuya Mitarai and Nobuhiko Nishiyama and Hideki Yagi and Tomohiro Amemiya and Shigehisa Arai},
  title = {Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding},
  booktitle = {},
  year = 2019,
}