@article{CTT100908500,
  author = {Mayumi B. Takeyama and Koji Kashima and Tomoji Nakamura and Takayuki Ohba},
  title = {工学的立場からの農業支援の一端},
  journal = {電子情報通信学会論文誌 C},
  year = 2023,
}

@inproceedings{CTT100908495,
  author = {Norio Chujo and Hiroyuki Ryoson and Koji Sakui and Shinji Sugatani and Tomoji Nakamura and Takayuki Ohba},
  title = {Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908498,
  author = {Takashi Funakoshi and Hiroyuki Ryoson and Kosuke Suzuki and Katsunori Komehana and Tomoji Nakamura and Takayuki Ohba},
  title = {9W/cm2/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908496,
  author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
  title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908499,
  author = {T. Kudo and Y. Satake and T. Funaki and N. Araki and Z. Chen and T. Nakamura and T. Ohba},
  title = {Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration},
  booktitle = {},
  year = 2023,
}