@article{CTT100821117,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Masato Furukawa and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer},
  journal = {Japanese Journal of Applied Physics},
  year = 2019,
}

@inproceedings{CTT100803284,
  author = {菊地 健彦 and 白 柳 and 御手洗 拓矢 and 八木 英樹 and 新田 俊之 and 古川 将人 and 雨宮 智宏 and 西山 伸彦},
  title = {引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803261,
  author = {Takayuki Miyazaki and Fumihito Tachibana and Takehiko Kikuchi and Takuo Hiratani and Hideki Yagi and Moataz Eissa and Takuya Mitarai and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {Taper Length Dependence of Double-Taper-Type Coupler for GaInAsP/SOI Hybrid Integrated Platform},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803265,
  author = {Takehiko Kikuchi and Liu Bai and Takuya Mitarai and Hideki Yagi and Tomohiro Amemiya and Nobuhiko Nishiyama and Shigehisa Arai},
  title = {High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803289,
  author = {宮嵜 隆之 and 立花 文人 and 菊地 健彦 and 平谷 拓生 and 八木 英樹 and Moataz Eissa and 御手洗 拓矢 and 雨宮 智宏 and 西山 伸彦 and 荒井 滋久},
  title = {III-V/Siハイブリッド集積プラットホーム実現に向けたハイブリッド/シリコン領域2段テーパ導波路のテーパ構造依存性},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100803297,
  author = {白 柳 and 菊地 健彦 and 御手洗 拓矢 and 西山 伸彦 and 八木 英樹 and 雨宮 智宏 and 荒井 滋久},
  title = {Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding},
  booktitle = {},
  year = 2019,
}