@article{CTT100874041,
  author = {Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen},
  title = {Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via},
  journal = {IEEE Transactions on Electron Devices},
  year = 2021,
}

@article{CTT100843204,
  author = {鹿島光司 and 伊藤浩之 and 深水克郎 and 大場隆之},
  title = {月での米作りのための自動化・センシング技術},
  journal = {電子情報通信学会誌},
  year = 2021,
}

@misc{CTT100903901,
  author = {大場隆之 and 中條　徳男},
  title = {積層メモリ},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-197979(2021/12/06), 特開2023-083955(2023/06/16)}
}


@misc{CTT100900361,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-153314(2021/09/21), 特開2023-045099(2023/04/03)}
}


@misc{CTT100900356,
  author = {大場隆之 and 菅谷　慎二　},
  title = {積層デバイスの製造方法、および、積層デバイス},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-159670(2021/09/29), 特開2023-049739(2023/04/10)}
}


@misc{CTT100892288,
  author = {大場隆之 and 菅谷　慎二},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-113963(2021/07/09), 特開2023-010103(2023/01/20)}
}


@misc{CTT100885389,
  author = {大場隆之},
  title = {半導体装置及びその製造方法},
  howpublished = {公開特許},
  year = 2022,
  month  = {},
  note   = {特願2021-067855(2021/04/13), 特開2022-162831(2022/10/25)}
}


@misc{CTT100865141,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置および半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038816(2020/03/06), 特開2021-141238(2021/09/16), 特許第7411959号(2023/12/28)}
}


@misc{CTT100865146,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置とその製造方法},
  howpublished = {登録特許},
  year = 2024,
  month  = {},
  note   = {特願2020-038818(2020/03/06), 特開2021-141240(2021/09/16), 特許第7424580号(2024/01/22)}
}


@misc{CTT100865155,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038817(2020/03/06), 特開2021-141239(2021/09/16), 特許第7357288号(2023/09/28)}
}


@misc{CTT100865166,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置とその制御方法},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2020-038815(2020/03/06), 特開2021-140555(2021/09/16)}
}


@misc{CTT100864136,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-005051(2020/01/16), 特開2021-114347(2021/08/05), 特許第7340178号(2023/08/30)}
}


@misc{CTT100862930,
  author = {大場隆之 and 菅谷　慎二　},
  title = {３次元デバイスおよび３次元デバイスを製造する方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-234428(2019/12/25), 特開2021-103735(2021/07/15), 特許第7403765号(2023/12/15)}
}


@misc{CTT100860431,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183605(2019/10/04), 特開2021-061078(2021/04/15), 特許第7282329号(2023/05/19)}
}


@misc{CTT100860426,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2019-190110(2019/10/17), 特開2021-064762(2021/04/22)}
}


@misc{CTT100860423,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183712(2019/10/04), 特開2021-061292(2021/04/15), 特許第7272587号(2023/05/01)}
}


@misc{CTT100860422,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2019-190528(2019/10/17), 特開2021-068737(2021/04/30)}
}


@misc{CTT100846520,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-167207(2019/09/13), 特開2021-044045(2021/03/18), 特許第7320227号(2023/07/26)}
}