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中村友二 2016年 研究業績一覧 (3件 / 25件)
論文
国際会議発表 (査読有り)
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Aki Dote,
Hideki Kitada,
Yoriko Mizushima,
Tomoji Nakamura,
Seiki Sakuyama.
Characterization of Warpages and Layout-Dependent Local-Deformations for Large Die 3D Stacking,
2016 IEEE 66th Electronic Components and Technology Conference,
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th,
IEEE,
pp. 1899,
June 2016.
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Y. S. Kim,
S. Kodama,
Y. Mizushima,
T. Nakamura,
N. Maeda,
K. Fujimoto,
A. Kawai,
T. Ohba.
Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics,
2016 IEEE 66th Electronic Components and Technology Conference,
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th,
IEEE,
pp. 1471-1476,
June 2016.
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