@article{CTT100908500,
  author = {武山 真弓 and 鹿島 光司 and 中村 友二 and 大場 隆之},
  title = {工学的立場からの農業支援の一端},
  journal = {電子情報通信学会論文誌 C},
  year = 2023,
}

@article{CTT100738469,
  author = {Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Akira Uedono and Takayuki Ohba},
  title = {Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure},
  journal = {Microelectronic Engineering},
  year = 2017,
}

@article{CTT100738441,
  author = {Dote Aki and Kitada Hideki and Mizushima Yoriko and Nakamura Tomoji and Sakuyama Seiki},
  title = {Analyzing and modeling methods for warpages of thin and large dies with redistribution layer},
  journal = {Jpn. J. Appl. Phys.},
  year = 2016,
}

@article{CTT100738460,
  author = {小林 靖志 and 中田 義弘 and 中村 友二 and 武山 眞弓 and 佐藤 勝 and 野矢 厚},
  title = {3D/2.5D-IC TSVに向けた低温成膜SiNxの特性評価},
  journal = {電気学会論文誌. C},
  year = 2015,
}

@article{CTT100738458,
  author = {Imada Tadahiro and Nakata Yoshihiro and Ozaki Shiro and Kobayashi Yasushi and Nakamura Tomoji},
  title = {Systematic investigation of silylation materials for recovery use of low-k material plasma damage},
  journal = {Jpn. J. Appl. Phys.},
  year = 2015,
}

@article{CTT100738459,
  author = {神吉 剛司 and 池田 淳也 and 中田 義弘 and 谷 元昭 and 中村 友二},
  title = {半導体プロセスを応用した高信頼性微細配線技術の開発},
  journal = {エレクトロニクス実装学会誌},
  year = 2015,
}

@article{CTT100741614,
  author = {Hisashi Sato and Nobuyuki Shishido and Shoji Kamiya and Kozo Koiwa and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo},
  title = {Local distribution of residual stress of Cu in LSI interconnect},
  journal = {MaterialsLetters},
  year = 2014,
}

@article{CTT100741611,
  author = {Chuantong Chen and Kozo Koiwa and Nobuyuki Shishido and Shoji Kamiya and Masaki Omiya and Hisashi Sato and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Tadahiro Nagasawa},
  title = {Specimen size effect on elastic-plastic strength evaluation of interface between thin films},
  journal = {Eng. Fract. Mech.},
  year = 2014,
}

@article{CTT100741612,
  author = {Chuantong Chen and Nobuyuki Shishido and Shoji Kamiya and Kozo Koiwa and Hisashi Sato and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Toshiaki Suzuki},
  title = {Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects},
  journal = {Microelectronic Engineering},
  year = 2014,
}

@article{CTT100741613,
  author = {Nobuyuki Shishido and Yuka Oura and Hisashi Sato and Shoji Kamiya and Kozo Koiwa and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Toshiaki Suzuki},
  title = {Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer},
  journal = {Microelectronic Engineering},
  year = 2014,
}

@article{CTT100738462,
  author = {Mizushima Yoriko and Kim Youngsuk and Nakamura Tomoji and Sugie Ryuichi and Hashimoto Hideki and Uedono Akira and Ohba Takayuki},
  title = {Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration},
  journal = {Jpn. J. Appl. Phys.},
  year = 2014,
}

@article{CTT100741617,
  author = {Mayumi B. Takeyama and Masaru Sato and Yoshihiro Nakata and Yasushi Kobayashi and Tomoji Nakamura and Atsushi Noya},
  title = {Characterization of silicon nitride thin films deposited by reactive sputtering and plasma-enhanced CVD at Low temperatures},
  journal = {Japanese Journal of Applied Physics},
  year = 2014,
}

@article{CTT100741616,
  author = {Noriyuki Taoka and Osamu Nakatsuka and Yoriko Mizushima and Hideki Kitada and Young Suk Kim and Tomoji Nakamura and Takayuki Ohba and Shigeaki Zaima},
  title = {Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction},
  journal = {Japanese Journal of Applied Physics},
  year = 2014,
}

@article{CTT100741620,
  author = {Akira Uedono and Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Takayuki Ohba and Nakaaki Yoshihara and Nagayasu Oshima and Ryoichi Suzuki},
  title = {Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic},
  journal = {Journal of Applied Physics},
  year = 2014,
}

@article{CTT100738464,
  author = {神吉 剛司 and 池田 淳也 and 須田 章一 and 小林 靖志 and 中田 義弘 and 中村 友二},
  title = {3D/2.5D-IC向けチップ間接続配線の高信頼性を実現するバリア技術 (次世代電子機器を支える三次元積層技術と先端実装の設計・評価技術論文特集)},
  journal = {電子情報通信学会論文誌. C, エレクトロニクス},
  year = 2013,
}

@inproceedings{CTT100908498,
  author = {Takashi Funakoshi and Hiroyuki Ryoson and Kosuke Suzuki and Katsunori Komehana and Tomoji Nakamura and Takayuki Ohba},
  title = {9W/cm2/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908495,
  author = {Norio Chujo and Hiroyuki Ryoson and Koji Sakui and Shinji Sugatani and Tomoji Nakamura and Takayuki Ohba},
  title = {Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908496,
  author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
  title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908499,
  author = {T. Kudo and Y. Satake and T. Funaki and N. Araki and Z. Chen and T. Nakamura and T. Ohba},
  title = {Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100738468,
  author = {Aki Dote and Hideki Kitada and Yoriko Mizushima and Tomoji Nakamura and Seiki Sakuyama},
  title = {Characterization of Warpages and Layout-Dependent Local-Deformations for Large Die 3D Stacking},
  booktitle = {Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th},
  year = 2016,
}

@inproceedings{CTT100738574,
  author = {Y. S. Kim and S. Kodama and Y. Mizushima and T. Nakamura and N. Maeda and K. Fujimoto and A. Kawai and T. Ohba},
  title = {Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics},
  booktitle = {Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th},
  year = 2016,
}

@misc{CTT100821996,
  author = {大場隆之 and 中村友二},
  title = {３次元集積化技術の現状と将来展望},
  year = 2020,
}

@misc{CTT100738463,
  author = {中村 友二},
  title = {LSIの配線技術と表面科学},
  year = 2014,
}

@misc{CTT100741626,
  author = {中村友二},
  title = {表面改質技術－現状と今後の展開},
  year = 2013,
}

@misc{CTT100741628,
  author = {中村 友二 and 鈴木 貴志},
  title = {LSI多層配線の信頼性},
  year = 2009,
}