@article{CTT100874041, author = {Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen}, title = {Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via}, journal = {IEEE Transactions on Electron Devices}, year = 2021, }