@article{CTT100908500,
  author = {武山 真弓 and 鹿島 光司 and 中村 友二 and 大場 隆之},
  title = {工学的立場からの農業支援の一端},
  journal = {電子情報通信学会論文誌 C},
  year = 2023,
}

@inproceedings{CTT100908498,
  author = {Takashi Funakoshi and Hiroyuki Ryoson and Kosuke Suzuki and Katsunori Komehana and Tomoji Nakamura and Takayuki Ohba},
  title = {9W/cm2/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908495,
  author = {Norio Chujo and Hiroyuki Ryoson and Koji Sakui and Shinji Sugatani and Tomoji Nakamura and Takayuki Ohba},
  title = {Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908496,
  author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
  title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908499,
  author = {T. Kudo and Y. Satake and T. Funaki and N. Araki and Z. Chen and T. Nakamura and T. Ohba},
  title = {Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration},
  booktitle = {},
  year = 2023,
}

@misc{CTT100903901,
  author = {大場隆之 and 中條　徳男},
  title = {積層メモリ},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-197979(2021/12/06), 特開2023-083955(2023/06/16)}
}


@misc{CTT100900361,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-153314(2021/09/21), 特開2023-045099(2023/04/03)}
}


@misc{CTT100900356,
  author = {大場隆之 and 菅谷　慎二　},
  title = {積層デバイスの製造方法、および、積層デバイス},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-159670(2021/09/29), 特開2023-049739(2023/04/10)}
}


@misc{CTT100892288,
  author = {大場隆之 and 菅谷　慎二},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-113963(2021/07/09), 特開2023-010103(2023/01/20)}
}


@misc{CTT100865141,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置および半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038816(2020/03/06), 特開2021-141238(2021/09/16), 特許第7411959号(2023/12/28)}
}


@misc{CTT100865155,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038817(2020/03/06), 特開2021-141239(2021/09/16), 特許第7357288号(2023/09/28)}
}


@misc{CTT100864136,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-005051(2020/01/16), 特開2021-114347(2021/08/05), 特許第7340178号(2023/08/30)}
}


@misc{CTT100862930,
  author = {大場隆之 and 菅谷　慎二　},
  title = {３次元デバイスおよび３次元デバイスを製造する方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-234428(2019/12/25), 特開2021-103735(2021/07/15), 特許第7403765号(2023/12/15)}
}


@misc{CTT100860431,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183605(2019/10/04), 特開2021-061078(2021/04/15), 特許第7282329号(2023/05/19)}
}


@misc{CTT100860423,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183712(2019/10/04), 特開2021-061292(2021/04/15), 特許第7272587号(2023/05/01)}
}


@misc{CTT100846520,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-167207(2019/09/13), 特開2021-044045(2021/03/18), 特許第7320227号(2023/07/26)}
}


@misc{CTT100842104,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-050060(2019/03/18), 特開2020-155473(2020/09/24), 特許第7255797号(2023/04/03)}
}


@misc{CTT100842085,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-050061(2019/03/18), 特開2020-155474(2020/09/24), 特許第7222481号(2023/02/07)}
}