S-parameter-based modal decomposition of multiconductor transmission lines and its application to de-embedding

Publication Information

Title

Japanese:
English:	S-parameter-based modal decomposition of multiconductor transmission lines and its application to de-embedding

Author

Japanese:	天川修平, 山長功, 伊藤浩之, 佐藤高史, 石原昇, 益一哉.
English:	S. Amakawa, K. Yamanaga, H. Ito, T. Sato, N. Ishihara, K. Masu.

Language

English

Journal/Book name

Japanese:
English:	International Conference on Microelectronic Test Structures (ICMTS)

Volume, Number, Page

pp. 177-180

Published date

Apr. 2009

Publisher

Japanese:
English:

Conference name

Japanese:
English:	International Conference on Microelectronic Test Structures (ICMTS)

Conference site

Japanese:
English:	Oxnard, California, USA

File

DOI