Top Layer Plating Lead Maximization for BGA Packages

Publication Information

Title

Japanese:
English:	Top Layer Plating Lead Maximization for BGA Packages

Author

Japanese:	富岡洋一, 高橋篤司.
English:	Yoichi Tomioka, Atsushi Takahashi.

Language

English

Journal/Book name

Japanese:	電子情報通信学会 2009ソサイエティ大会講演論文集 (A-3-10)
English:	Proc. the 2009 IEICE Society Conference (A-3-10)

Volume, Number, Page

Vol. A p. 59

Published date

Sept. 17, 2009

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:	新潟市
English:

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