High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration

Publication Information

Title

Japanese:
English:	High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration

Author

Japanese:	菊地健彦, 白柳, 御手洗拓矢, 八木英樹, 雨宮智宏, 西山伸彦, 荒井滋久.
English:	Takehiko Kikuchi, Liu Bai, Takuya Mitarai, Hideki Yagi, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

May 2019

Publisher

Japanese:
English:

Conference name

Japanese:
English:	2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)

Conference site

Japanese:
English: