International Conference (Reviewed)

• Takehiko Kikuchi, Munetaka Kurokawa, Naoki Fujiwara, Naoko Inoue, Takuya Mitarai, Hidenari Fujikata, Takuo Hiratani, Toshiyuki Nitta, Yuhki Itoh, Tohma Watanabe, Chang-Yong Lee, Akira Furuya, Tsuyoshi Horikawa, Nobuhiko Nishiyama, Hideki Yagi. Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process, IEEE Silicon Photonics Conference, Apr. 2024.
• Takuo Hiratani, Naoki Fujiwara, Naoko Inoue, Munetaka Kurokawa, Takehiko Kikuchi, Takuya Mitarai, Toshiyuki Nitta, Tohma Watanabe, Hidenari Fujikata, Nobuhiko Nishiyama, Hideki Yagi. SOA Integrated InP/Si Hybrid Tunable Laser by Utilizing Chip-on-Wafer Hydrophilic Bonding, IEEE Silicon Photonics Conference, Apr. 2024.

Domestic Conference (Not reviewed / Unknown)

• Takuya Okimoto, Takuya Mitarai, Naoki Fujiwara, Naoko Inoue, Takuo Hiratani, Munetaka Kurokawa, Takehiko Kikuchi, Toshiyuki Nitta, Tohma Watanabe, Hidenari Fujikata, Tsuyoshi Horikawa, Nobuhiko Nishiyama, Hideki Yagi. エアクラッド構造を有するInP/Siハイブリッド導波路型フォトダイオード, 2024年電子情報通信学会ソサイエティ大会, Sept. 2024.
• Takehiko Kikuchi, Munetaka Kurokawa, Naoki Fujiwara, Naoko Inoue, Takuya Mitarai, Hidenari Fujikata, Takuo Hiratani, Toshiyuki Nitta, Yuhki Itoh, Tohma Watanabe, Chang-Yong Lee, Akira Furuya, Tsuyoshi Horikawa, Nobuhiko Nishiyama, Hideki Yagi. Monolithic integration of various types of InP-based epitaxial structures on Si-photonic circuit using III-V chip-on-SOI wafer bonding, 第71回応用物理学会春季学術講演会, Mar. 2024.
• Takuo Hiratani, Naoki Fujiwara, Naoko Inoue, Munetaka Kurokawa, Takehiko Kikuchi, Takuya Mitarai, Toshiyuki Nitta, Tohma Watanabe, Hidenari Fujikata, Nobuhiko Nishiyama, Hideki Yagi. Hybrid tunable lasers with InP-based gain region bonded on Si-slab waveguide structure, 電子情報通信学会総合大会, Mar. 2024.
• Naoko Inoue, Takuo Hiratani, Naoki Fujiwara, Takehiko Kikuchi, Munetaka Kurokawa, Takuya Mitarai, Toshiyuki Nitta, Tohma Watanabe, Nobuhiko Nishiyama, Hideki Yagi. SOA integrated hybrid tunable laser by InP chip-on-SOI wafer bonding using UV-ozone hydrophilization, 第71回応用物理学会春季学術講演会, Mar. 2024.

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