Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process

Publication Information

Title

Japanese:
English:	Monolithic integration of various-type III-V epitaxial structures on silicon-photonics platform using chip-on-wafer hydrophilic bonding process

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Language

English

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Volume, Number, Page

Published date

Apr. 2024

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Conference name

Japanese:
English:	IEEE Silicon Photonics Conference

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