CoPt alloy is the appropriate material for the stacking layers owing to strong PMA for Co-rich alloy and controllability of Ku by changing the Co composition. CoPt stacking layers with different alternatively Ku are required. To deposit such stacking layers, the electrodeposition condition has been studied. CoPt layers with various compositions were successfully deposited by adjusting the applied voltage. However, the surface thin film deposited by DC electrodeposition was too rough for spin device fabrication. We conducted pulse electrodeposition and obtained an ultra-thin film with smooth morphology and good magnetic property.
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