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研究業績一覧 (6件)
論文
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Kuan Lu,
Byunggi Kim,
Masahiro Nomura,
Jiyong Park,
ChaBum Lee.
Silicon-via (Si-via) hole metrology and inspection by grayfield edge diffractometry,
Journal of Manufacturing Processes,
Vol. 133,
503-509,
Nov. 2024.
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Daiki Higuma,
Jo~ao Vitor Thomsen Silveira,
Byunggi Kim,
Masahiro Nomura,
Kazuyoshi Fushinobu.
Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm,
Journal of Electronic Packaging,
Vol. 146,
Aug. 2024.
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Byunggi Kim,
Félix Barbier-Chebbah,
Yohei Ogawara,
Laurent Jalabert,
Ryoto Yanagisawa,
Roman Anufriev,
Masahiro Nomura.
Anisotropy Reversal of Thermal Conductivity in Silicon Nanowire Networks Driven by Quasi-Ballistic Phonon Transport,
ACS Nano,
Vol. 18,
No. 15,
Apr. 2024.
国際会議発表 (査読なし・不明)
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Kuan Lu,
Pengfei Lin,
Heebum Chun,
Jiyong Park,
Byunggi Kim,
Masahiro Nomura,
ChaBum Lee.
Via Metrology, Inspection and Digital Review System for Advanced Electronics Packaging,
International Conference on Precision Engineering and Sustainable Manufacturing (PRESM2024),
July 2024.
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B. Kim,
H. Kurokawa,
K. Sakai,
K. Koshino,
H. Kosaka,
M. Nomura.
Diamond optomechanical crystals for coherent quantum transduction,
NANOSCALE AND MICROSCALE HEAT TRANSFER VIII,
June 2024.
国内会議発表 (査読なし・不明)
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