論文

• Tetsuya Shimizu, Yuma Ishimoto, Tso-Fu Mark Chang, Hikaru Kinashi, Takashi Nagoshi, Tatsuo Sato, Masato Sone. Cu Wiring into Nano-Scale Holes by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte with a Continuous Flow Reaction System, The Journal of Supercritical Fluids, Elsevier, Vol. 60, pp. 60-64, May 2014.

国際会議発表 (査読有り)

• Masato Sone, Tetsuya Shimizu, Tso-Fu Mark Chang, Yuma Ishimoto, Hikaru Kinashi, Takashi Nagoshi, Tatsuo Sato. Nanoscale Wiring By Cu Electrodeposition in Supercritical Carbon Dioxide (Invited Lecture), 224th ECS Meeting, ECS, Nov. 2013.
• Yuma Ishimoto, Tetsuya Shimizu, Tso-Fu Mark Chang, Tatsuo Sato, Masato Sone. Cu Wiring by Electrodeposition in supercritical CO2 Emulsified Electrolyte using Continuous flow reaction system, TACT2013, International Thin Films Conference, TACT2013, Oct. 2013.
• Tetsuya Shimizu, Yuma Ishimoto, Tso-Fu Mark Chang, Tatsuo Sato, Masato Sone. Continuous flow reaction system for nanoscale wiring by Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles, 38th International Conference on Micro and Nano Engineering, (MNE2012), 38th International Conference on Micro and Nano Engineering, (MNE2012), pp. P086-027, Sept. 2012.

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