国際会議発表 (査読有り)

• Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Evaluation of Warpage Behavior of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-Layered Structures caused by Thermal Treatment, CPIT2024, New Method of Damage and Failure Analysis of Structural Part, CPIT2024, New Method of Damage and Failure Analysis of Structural Part, Oct. 2024.
• Tatsuhiko Mori, Tomoyuki Kurioka, Chun-Yi Chen, Tso-Fu Mark Chang, Katsuyuki Machida, Hiroyuki Ito, Yoshihiro Miyake, Masato Sone. Thermal Treatment Effects on Warpage of an Octagonal Electrodeposited-Au Proof Mass with a Ti/Au Multi-layered Structure Toward High-sensitive Accelerometers, 50th International Micro and Nano Engineering Conference (MNE 2024 Montpellier), 50th International Micro and Nano Engineering Conference (MNE 2024 Montpellier), Sept. 2024.

国内会議発表 (査読有り)

• 森 達彦, 栗岡 智行, Chen Chun-Yi, Chang Tso-Fu Mark, 町田 克之, 伊藤 浩之, 三宅 美博, 曽根 正人. Ti/Au 積層電気金めっき錘の反り変形の熱処理温度依存性評価, 第71回応用物理学会春季学術講演会, Proc. The 71st JSAP Spring MeetinProc., p. 23a-12K-2, Mar. 2024.

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