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Patent Information
Title
半導体基材およびその製造方法
Author
Jun-ichi Hanna
.
Kind
Patent
Status
Registered
Applicant
国立大学法人東京工業大学.
Filing Date
2011/08/19
Application Number
特願2011-179997
Unexamined Application Date
2013/02/28
Publication Number
特開2013-042097
Registration Date
2016/03/18
Registration Number
特許第5901048号
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