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Patent Information


Title
有機半導体材料 
Author
Jun-ichi Hanna, takayuki usui, Hiroaki Iino, akira oono.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, ＤＩＣ株式会社.  
Filing Date
2014/10/09
Application Number
特願2014-208316
Unexamined Application Date
2015/03/19
Publication Number
特開2015-053497
Registration Date
2017/08/10
Registration Number
特許第6188663号

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