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Patent Information


Title
半導体装置 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, 本田技研工業株式会社.  
Filing Date
2019/03/18
Application Number
特願2019-050060
Unexamined Application Date
2020/09/24
Publication Number
特開2020-155473
Registration Date
2023/04/03
Registration Number
特許第7255797号

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