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Patent Information


Title
半導体装置 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Published 
Applicant
国立大学法人東京工業大学, 本田技研工業株式会社.  
Filing Date
2019/10/17
Application Number
特願2019-190528
Unexamined Application Date
2021/04/30
Publication Number
特開2021-068737

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