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Patent Information


Title
半導体装置 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, 本田技研工業株式会社.  
Filing Date
2019/10/04
Application Number
特願2019-183605
Unexamined Application Date
2021/04/15
Publication Number
特開2021-061078
Registration Date
2023/05/19
Registration Number
特許第7282329号

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