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Patent Information


Title
半導体装置とその製造方法 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, 本田技研工業株式会社.  
Filing Date
2020/03/06
Application Number
特願2020-038818
Unexamined Application Date
2021/09/16
Publication Number
特開2021-141240
Registration Date
2024/01/22
Registration Number
特許第7424580号

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