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Patent Information
Title
半導体装置
Author
Takayuki Ohba
.
Kind
Patent
Status
Published
Applicant
国立大学法人東京工業大学, 株式会社アドバンテスト.
Filing Date
2021/07/09
Application Number
特願2021-113963
Unexamined Application Date
2023/01/20
Publication Number
特開2023-010103
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