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Patent Information


Title
半導体装置 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Published 
Applicant
国立大学法人東京工業大学, 株式会社アドバンテスト.  
Filing Date
2021/07/09
Application Number
特願2021-113963
Unexamined Application Date
2023/01/20
Publication Number
特開2023-010103

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