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Patent Information
Title
ポリイミド、ポリイミドワニス、ポリイミド薄膜
Author
SHINJI ANDO
,
Ririka Sawada
.
Kind
Patent
Status
Published
Applicant
国立大学法人東京工業大学, 本州化学株式会社.
Filing Date
2022/08/22
Application Number
PCT/JP2022/031577
Unexamined Application Date
2023/03/02
Publication Number
WO 2023/027031
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