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Title
ポリイミド、ポリイミドワニス、ポリイミド薄膜 
Author
SHINJI ANDO, Ririka Sawada.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, 本州化学株式会社.  
Filing Date
2022/08/19
Application Number
特願2022-131038
Unexamined Application Date
2023/03/08
Publication Number
特開2023-031285
Registration Date
2023/03/29
Registration Number
特許第7253215号
Note
権利存続

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