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Patent Information


Title
半導体装置 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Published 
Applicant
国立大学法人東京工業大学.  
Filing Date
2021/09/21
Application Number
特願2021-153314
Unexamined Application Date
2023/04/03
Publication Number
特開2023-045099

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