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Patent Information


Title
ポリイミド、ポリイミドワニス、ポリイミド薄膜 
Author
SHINJI ANDO, Ririka Sawada.  
Kind
Patent 
Status
Registered 
Applicant
国立大学法人東京工業大学, 本州化学株式会社.  
Filing Date
2023/03/15
Application Number
特願2023-040554
Unexamined Application Date
2023/05/09
Publication Number
特開2023-063487
Registration Date
2023/12/19
Registration Number
特許第7406058号

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